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| Base material: FR4, FR1, FR2, Ceramics, Aluminum, Rogers, F4B, F4BK, F4BT, TP, PF, CEM-1, CEM-3, etc. |
| Board thickness: 0.30 to 3.20mm (12 to 26mil) |
| Copper thickness: 0.50 to 5 ounce |
| Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask |
| Minimum line width: 0.1mm (4mil) |
| Minimum line space: 0.1mm (4mil) |
| Minimum hole diameter: 0.25mm (10mil) |
| PTH hole diameter tolerance: +/-0.076mm (+/-3mil) |
| NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil) |
| Maximum board size: 460 x 620mm (18 x 24) |
| Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers |
